636 bonde results

Electronics Forum: bonde (Page 1 of 64)

Plating for aluminum wire bonding

Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini

Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef

Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service

COB Issue's (Non-Sticking)

Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef

Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the

wirebonding

Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef

Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin

Au Wire bonding failure

Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare

Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of

Wirebond issues near SM

Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong

Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c