Electronics Forum | Wed Sep 09 21:20:26 EDT 1998 | Simon Ting
hi, 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of epoxy,
Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon
| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e
Electronics Forum | Wed Jun 17 14:46:18 EDT 1998 | Robert Smith
1. I need to be able to probe into my product's substrate which has all components in die form. I would need to be able to bring out any pad information for hookup to a scope or any other external piece of equipment. I do not have the convenience o
Electronics Forum | Tue Jun 02 17:52:06 EDT 1998 | Dave F
| Is there someone who can tell me where I can buy rolls of leader tape for SMT component tapes. Is there a good way of bonding leader tapes, maybe a special instrument to do the job. Thanks for any help. Igmar: The following companies supply SMT co
Electronics Forum | Mon Jun 08 15:47:39 EDT 1998 | Igmar
| | Is there someone who can tell me where I can buy rolls of leader tape for SMT component tapes. Is there a good way of bonding leader tapes, maybe a special instrument to do the job. Thanks for any help. | Igmar: The following companies supply SM
Electronics Forum | Wed Jun 03 09:48:47 EDT 1998 | Gary
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Tue Nov 27 15:37:15 EST 2001 | Dave G
I've seen some glass melf's fall off in our facility due to the glue not adhering to the body very well. You could pick these off with your finger after they had cured. (With little or no effort - I never bothered to actually measure the force requir
Electronics Forum | Wed Nov 28 20:45:03 EST 2001 | dougk
We�ve also had glass diode difficulties- poor adhesion while all other parts are fine (including tall parts). I�ve received some interesting information from Heraeus: It seems the newer glues create a much stronger bond to SMD�s, except glass diodes.
Electronics Forum | Wed Oct 10 17:56:35 EDT 2001 | seand
Hello all, My respone here is to add options for evaluation for the engineer. Not to convey that they are the only options as that would be reckless. Cyberoptics does have a standard line of machines configured for in line paste inspection. Some
