Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel
Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Mon Nov 14 02:40:38 EST 2022 | cooper
We are looking for companies in Europe who can provide Samsung mounter installation and after-sales service with generous compensation, interested companies please contact us. Cooper Sales Director Shenzhen Jaguar Automation Equipment Co., Ltd TEL
Electronics Forum | Thu Feb 15 18:35:10 EST 2024 | prestonames
Hi Mahmoud, I hope you were able to find a solution for your project! My company recently purchased an ASM Eagle Xtreme Gold Wire Bonder and we have been unable to locate the manual. Is it possible to share the manual that you have over email? Pleas
Electronics Forum | Fri Feb 16 15:12:27 EST 2024 | capse
ASMPT SEMI USA, Inc. 7850 S Hardy Drive, Suite 110, Tempe, AZ 85284-112 U.S.A. Phone: +1 602 437 4760
Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit
Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak
Electronics Forum | Wed May 20 09:52:50 EDT 2009 | dwelch123
Use a push/pull tester. I use an OBA inst. works Ltd. tester. Just because mask comes off with bonder doesn't mean bonder is strong or cured right. Mask can be weak in between pads do to area size. Do it right and you'll know for sure. To many people