Electronics Forum | Tue Jun 05 15:56:22 EDT 2007 | adlsmt
Can you use a 4682 fine pitch bonder?
Electronics Forum | Wed Jun 06 19:17:43 EDT 2007 | bryanhanton
4682 "baby bonder" not suitable. Thank you for your reply. Best Regards Bryan
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Fri Apr 18 18:11:38 EDT 2003 | slthomas
"glue the floater in place with chip bonder before reflow" gets my vote. We have decals for DPAKs and TO-252's that don't match either specification, and chip bonder is the only answer if they won't spin the board for you.
Electronics Forum | Sun Nov 06 14:12:07 EST 2005 | Danmens
I am looking for someone very familiar with ASM wire-bonders (AB356) to train us after hours on a temporary basis. You must reside in MA, NH or RI. Send an e-mail if you are interested. dmendoza@mnc.com
Electronics Forum | Sat May 26 02:50:15 EDT 2007 | bryanhanton
Hi. Currently we are in the market for UIC 4684A TAB Bonder. If anyone would like to sell such equipment, or knows where a machine or machines are located, please leave details. Best Regards Bryan Hanton
Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit
Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Electronics Forum | Tue Jun 05 13:50:56 EDT 2007 | bryanhanton
Finder's Fee negociable for this equipment
