Electronics Forum | Mon Jan 25 01:24:27 EST 2010 | sparrow
If the bumps are so small, I do not see any reason for considering Mydata, Siemens or any SMT p&p machine. Datacon's die bonders are very good ones. In your case, I would keep using them.
Electronics Forum | Mon Feb 15 21:24:11 EST 2010 | seabas
The CX-1 is a good choice. As accuarte as a die bonder, and as fast as an SMT placer. We love ours.
Electronics Forum | Tue Mar 16 20:45:51 EDT 2010 | r_nelson777
check out DIAS in HongKong. They may have what you need. website. http://www.diasautomation.com email. sales@diasautomation.com
Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg
Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results
Electronics Forum | Mon Apr 25 14:44:26 EDT 2022 | dwl
You could try putting a dot of adhesive like Loc tight chip bonder or similar between the pads. The adhesive will cure before the solder paste hits the reflow temp and hold the LED in place.
Electronics Forum | Mon Jul 31 18:41:07 EDT 2023 | emeto
Chip-bonder glue(Loctite 3612 for example) will harden at lower temperature way before paste goes to liquidus stage, so it will hold the part in place.
Electronics Forum | Fri Feb 16 15:12:27 EST 2024 | capse
ASMPT SEMI USA, Inc. 7850 S Hardy Drive, Suite 110, Tempe, AZ 85284-112 U.S.A. Phone: +1 602 437 4760
Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Wed Jan 31 17:30:54 EST 2007 | GS
Thanks a lot flipit, I am not directly involved in this "problem" but is my friend that have his CM rejecting PCBs because it says the "+" mark (spokes lengths) are out of tolerances. It seams CM bonder's require tolerance +/- 0,05(? not sure). I d
Electronics Forum | Mon Sep 30 16:36:00 EDT 2013 | richardconnell
I have a Universal Instruments Corporation TAB Bonder. Oldish machine. Initial fault on machine : - "Axis Head 1 Z DAC Limit error during move absolute command" Other fault seen after we reset power, Zeroed axis etc. - Axis Head 1 - Z error not re
