Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Fri Apr 14 07:53:44 EDT 2000 | Wolfgang Busko
Hi Paul, a planar surface is not what you get after reflow no matter how hard you try to get the best printing results. One thing is to flatten the surface again like the Sipad-technology but I don�t know if and how it�s applicable in your specific c
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Sun Oct 31 23:58:54 EST 1999 | John A.
Do both sides of that board contain larger IC's and other large components or just one side?? If just one side contains large components, try running the side with the smaller components first, and then run the other side last. If that doesn't work
Electronics Forum | Mon Jul 29 21:26:23 EDT 2002 | caldon
Just a small note...KNS Subcontracted an advanced placement machines and bonder from Datacon (Austria). With KNS moving all of their equipment production over seas Datacon (Also thought it was time to go direct)went direct in the US market. Datacon
Electronics Forum | Thu Apr 22 12:46:41 EDT 2004 | Mark
What type of chip bonder you use? I use Loctite 3611... part #25410 on my stencil screening and use epoxy cleaner, air hose and that takes care of our issues. If you use alchol it just hardens the epoxy so make sure its cleaned out good before restor
Electronics Forum | Fri Jan 20 02:34:16 EST 2006 | yihui
Hi, i'm david, new to this forum. Came across your posting about using a delvotec bonder to TS bond to a ENIG pad. Given that the immersion gold layer is thin, does the capillary scrub through the gold layer to expose the underlying nickel? Does your
Electronics Forum | Tue Oct 01 17:56:10 EDT 2013 | swag
I'd take a look at the power supply for the failed axis and see if it's still working. I've also seen encoders fail on motors but it's rare in my experience. Usually it's a power issue.
Electronics Forum | Tue Oct 01 18:44:24 EDT 2013 | richardconnell
Hi, I have limited capability on the Z axis. The axis will home to the mechanical switch limit and then drop to a point which I asssume to be the fiorst zero point below the mechanical switch limit. Then it gives the error. There is power to the mo
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
