Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef
We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet
Electronics Forum | Fri Jun 10 12:48:55 EDT 2016 | deanm
Kyle,thank you for steering me back on track. For relays and connectors I like Tom's suggestion provided you are allowed to add materials to your assemblies. An instant adhesive or perhaps a chip bonder (used in SMT) may work if the preheat is high e
Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas
To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I
Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL
With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including
Electronics Forum | Sat Sep 12 10:47:00 EDT 1998 | Jon Medernach
I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dime
Electronics Forum | Thu Mar 06 16:34:54 EST 2003 | msivigny
Hello gregp, IPC released 9850 on October 22, 2002 after the industry came together to standardize a method to determine placement capability as it relates to placement speed. As I'm sure you are aware, the standard gives placement machine manufactur
Electronics Forum | Fri Apr 18 13:47:19 EDT 2003 | davef
Brian What did we recommend? We just gave you a link so that you can see how to get your pictures on-line, so that we can see what�s going on. Anyhow, if we understand what you saying, [We're slow today. So, please be patient.] your situation is:
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
