Electronics Forum | Sat Jun 04 12:11:49 EDT 2011 | davef
Q1) How to identify on good or bad RF shield that could contribute to dewetting? A1) We use Alloy 770 and 752 [German silver] for our RF shields. We have never seen a solderability issue, even aged stock solders well. * Nickel Alloy 752, Nickel Silv
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Fri Sep 09 21:09:20 EDT 2011 | hegemon
Wow, a lot of questions here...and you are definitely doing some "tough sledding". To the point. If you have 3 - 22" zones you'll have to calc your belt speed and temperatures to match the solder paste requirements with regard to flux activation an
Electronics Forum | Thu Oct 04 00:19:14 EDT 2018 | gaintstar
Flason SMT yamaha nozzles: http://www.flason-smt.com/product/Yamaha-CL12mm-Feeder-KW1-M2200-100.html http://www.flason-smt.com/product/Yamaha-CL12mm-feeder-KW1-M2200-10X.html http://www.flason-smt.com/product/YAMAHA-CL16mm-SMT-Feeder-KW1-M3200-10X.ht
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
