Electronics Forum | Mon Mar 07 15:41:50 EST 2005 | John M
Is anyone aware of standards which would identify the clean room requirements for the wire bonding process ?
Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI
It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Wed Jun 25 08:50:54 EDT 2003 | russ
I believe that Fancort makes some finger protectors that are made of Metal (Aluminum, titanium, etc...) I don't know how well these would process through placement equipment however due to their thickness. Could you clean the Kapton residue off just
Electronics Forum | Wed Jun 25 08:58:02 EDT 2003 | cyber_wolf
I need something that is very thin so I can screen print while the fingers are protected. We have tried cleaning the fingers prior to shipment, but our customer tells us that even alcohol leaves enough residue to cause problems.
Electronics Forum | Mon Aug 02 11:21:29 EDT 2004 | sforman1
Use MicroCoat Technologies UV cure solder mask. will leave PCB absolutely clean. used in many PCB solder/wirebonding apps. http://www.m-coat.com
Electronics Forum | Tue Sep 10 10:42:36 EDT 2013 | capse
Plasma cleaning is used extensively to clean surfaces prior to wire bonding.
Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood
We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu
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