Electronics Forum | Thu Aug 09 16:24:27 EDT 2018 | ks0707
Hi Thomas, Thank you for your posting and I agree with you that Printing is the most difficult one. BTW, after you ran the one side (let's say Bottom side), my engineer worries about the distortion of flex board because of the thickness. In that ca
Electronics Forum | Thu Aug 09 14:00:51 EDT 2018 | tey422
To me the most challenge would be the printing step. If you can print it, you should able to run it with SMT. We ran similar thickness flex boards before. But it's long flex with small stiffener at both ends, and it was 10up array. You need fixture
Electronics Forum | Fri Jul 28 09:18:53 EDT 2017 | sumote
Fancort sells a router that will singulate the boards out of the panel, and smooth the edges at the same time. I had one of these at a previous job and it worked well enough. Programming is tedious (it is done at the machine by "learning" point to
Electronics Forum | Tue Jun 03 10:28:09 EDT 2014 | swag
Incoming inspection: Look for flaws and measure position of v-score as well as depth. If v-scored on both sides of panel, make sure v-scores are in alignment. Follow the PCB thru all processes inspecting after each stage of processing, especially
Electronics Forum | Fri Jun 13 16:23:47 EDT 2014 | esoderberg
I did not see any mention on the inner layer setback. We use 0.025" and have not had problems. Point loads with either a CAB or a FKN can sometimes be problematic. I would search out someone you know that has a fancort industries VDP5. This cuts th
Electronics Forum | Wed Dec 05 03:33:22 EST 2007 | longlee
We have done Paste-In-Hole process for 4 years.I think this prcess is suitable for 28-pins connector. Of course, you must assure the connecotr can endure high temperature firstly.Secondly, you need calculate the volume of solder paste, you can refere
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Sat Jun 13 00:25:59 EDT 1998 | Scott McKee
Last October I purchased a Mydata over a Phillips and Amistar. I've done things on my Mydata that is impossible on the other machines. I can build the top side and the bottom side of two boards at the same time (I print both sides at once). I can "
