Electronics Forum | Tue Apr 19 13:23:33 EDT 2016 | vchauhan
We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes
Electronics Forum | Mon Dec 13 21:05:34 EST 1999 | Curtis T.
Ken, we always build the bottom side of the board first. That also insures that there isn't any problems with the actives being reflowed and falling off in the glues curing process. By the way we do both paste and glue on the bottom of the boards t
Electronics Forum | Wed Mar 24 12:36:26 EST 2004 | wintech
Hello We are using a No-Clean process for a lot of boards that we do, but the customer needs the flux removed off the bottom side of the board and there is to many leaded components that can not go through a water wash, so is what we do is clean th
Electronics Forum | Thu Oct 12 08:12:51 EDT 2006 | realchunks
I have, but not for what you are trying. Different ovens and styles react differently when you try this, so you have to experiment to see how far you can go. Why do you think different temps top and bottom will solve the coplanairty issue? Is this
Electronics Forum | Tue Jan 15 10:08:19 EST 2019 | griinder
I'm looking for any experienced Graphicode software users for advice. We use Gerber EZ Teach(GC Powerplace) to offline program 2D inspection on our Momentum printers. I have an issue with mirrored apertures when creating my Bottom Side inspection pro
Electronics Forum | Tue Apr 25 10:42:38 EDT 2006 | TMC
Almost all of the components on the bottom side are passives however, there are a couple of mBGA's and qfp's. I am aware that even if the components on the bottom do get reflowed, surface tension of solder will hold them in place. As far as IC's, w
Electronics Forum | Fri Jul 17 21:55:34 EDT 1998 | Sergio Corcuera
| | Is there anybody with knowledge in the process with PHT components (Components with terminals) - Cause with make board with top and bottom side, with SMD and Auto Insertion Technology. So we want to do a Entire Cell with both technology, and wit
Electronics Forum | Tue Aug 13 10:09:10 EDT 2013 | dyoungquist
We have a Heller 1707EXL that we use for lead and lead-free production. It has both a mesh belt and edge rails. We run 90% of our assemblies on the mesh belt (leaving the edge rails wide open). I have noticed when profiling a board on the mesh bel
Electronics Forum | Wed Oct 09 11:59:56 EDT 2002 | slthomas
Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particularly one that focuses on different processes? I'm being asked to produce information from said
Electronics Forum | Wed Oct 09 14:15:56 EDT 2002 | slthomas
Pardon the cross-post from the design board....I thought maybe I should query both populations. Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particu
