Electronics Forum | Wed Oct 06 21:45:20 EDT 1999 | John
I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement b
Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko
| | I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme
Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto
Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b
Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Tue Oct 03 09:25:44 EDT 2006 | Brian
You might need to use a pallet that provides some shielding for the BGA that is hanging on the bottom of the board.
Electronics Forum | Tue Oct 03 13:08:39 EDT 2006 | Moby
This is an issue that we are seeing a lot! It used to be that the primary-side (component-side...top-side) had most of the active components. It was simple: reflow bottom first. Now, we are seeing both sides of the assembly having the same amount of
Electronics Forum | Thu Nov 16 08:57:00 EST 2017 | jandon
We found used Ersa HotFlow 2/14 reflow oven that does not have bottom side preheaters. Can it be easily and safely used in normal high mix/low volume production or is it built for specific products which does not need bottom preheaters?
