Electronics Forum | Wed Oct 06 21:45:20 EDT 1999 | John
I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement b
Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko
| | I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme
Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Nov 16 08:57:00 EST 2017 | jandon
We found used Ersa HotFlow 2/14 reflow oven that does not have bottom side preheaters. Can it be easily and safely used in normal high mix/low volume production or is it built for specific products which does not need bottom preheaters?
Electronics Forum | Wed Mar 05 08:05:46 EST 2003 | Yngwie
Thanx Marc..this is good input.
Electronics Forum | Tue Mar 04 00:55:12 EST 2003 | nifhail
In the double sided SMT process assembly, normally the bottom side will be processed first, due to it's lesser density as well as it's lesser heavy components. Apart from worrying about the component falling down, what are the potential problems that
Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto
Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b
Electronics Forum | Tue Mar 04 13:32:17 EST 2003 | MA/NY DDave
Hi Unless I am missing something, None if done right. YiEng, MA/NY DDave
