Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch
Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to
Electronics Forum | Wed Oct 06 21:45:20 EDT 1999 | John
I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement b
Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko
| | I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme
Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Thu Aug 15 05:39:23 EDT 2002 | surachai
Hi all ; Anyone have the experience with the double side reflow at the same time both top and bottom ? I want to know the description of this process and the possibility of this process ,or could you suggest me the source or contact person of this t
Electronics Forum | Thu Nov 16 08:57:00 EST 2017 | jandon
We found used Ersa HotFlow 2/14 reflow oven that does not have bottom side preheaters. Can it be easily and safely used in normal high mix/low volume production or is it built for specific products which does not need bottom preheaters?
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