Electronics Forum: bpm and micro (Page 1 of 4)

Can I replace this broken micro switch and solder the new one like this ?

Electronics Forum | Sun Jul 05 22:21:58 EDT 2020 | raoult

Hi, The micro switch is broken on my device, it was a tactile one (4mm) : image1, image2 Do you think I can buy another one and just solder it like this with 2 wires (I can't solder it back to where it was because it's too tiny I don't have the sk

Can I replace this broken micro switch and solder the new one like this ?

Electronics Forum | Mon Jul 06 16:46:39 EDT 2020 | emeto

If I was you, I would use solid copper wire and modify the new switch to have contacts same location and size as the old one. Then solder the same spot a s a full replacement.

Can I replace this broken micro switch and solder the new one like this ?

Electronics Forum | Mon Jul 06 14:54:36 EDT 2020 | dwl

The pictures are kinda fuzzy so its hard to tell of the center pad is electrically connected to anything. If it's not, if its just here for mechanical stability, then you're probably fine. The other thing to make sure of is that both switches are th

Can I replace this broken micro switch and solder the new one like this ?

Electronics Forum | Mon Jul 06 21:16:59 EDT 2020 | raoult

Thanks guys for your help. Sorry for the pic quality, the device is so small I had to zoom a lot with my phone. The switch is a tactile one, the plastic body is missing, and what you can see in the center is where the contact is made : when the swit

BGA lands and ICT

Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W

Mydata Pick and place

Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul

My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

BGA's and the Fuji IP2

Electronics Forum | Fri Jul 12 13:02:22 EDT 2002 | rocco

Hello !! One basic question ....Which pitch is considered micro BGA ? Thanks !!

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