Electronics Forum | Tue Mar 09 14:23:03 EST 2010 | zanolli
Hello SMTnetters We have a unique application requiring cleaning of an aggressive OA flux. A vapor degreasing process or the immersion of the parts in boiling solvents has some process advantages over an ultrasonic aqueous process. These advantages
Electronics Forum | Tue Jul 01 21:40:04 EDT 2008 | davef
Vapor degreasing systems * Thermal Equipment [Baron-Blakeslee]; Torrance, CA; thermalequipment.com * Exselect Engineering; Concord, ON CAN; exselect.com * Branson Ultrasonics; Danbury, CT; bransoncleaning.com * Greco Brothers; Providence, RI; grecob
Electronics Forum | Wed Sep 05 14:53:45 EDT 2001 | Jeff Meier
We have customers that are requiring no flux residue left on boards after soldering of non-water washable parts. We currently use Multicore Crystal 502 No-Clean to solder parts that are not washable. Has anyone come up with a good way to remove this
Electronics Forum | Wed Aug 14 10:44:04 EDT 2013 | sarason
In my limited experience. A Domestic Dishwasher with no water recycling like which is offered on some of the newer high priced models works a treat. Clearly this is batch. Inline filtering of the water supply is a good ideal. There are several ways o
Electronics Forum | Mon Jul 24 15:10:37 EDT 2006 | carln
Here are some additional comments that have been posted on the CircuitNet web site: Fist, the answer is the same regardless of the specific paste type, (leaded or non-leaded). High pressure sprays should never be applied to a stencil. Stencils are
Electronics Forum | Wed Sep 05 17:37:56 EDT 2001 | seand
Hello Jeff, If you have components on your board be careful of how low the frequency is that you will be applying to your board. Ultrasonics are great for cleaning stencils and bare boards at around 40kHz. These frequencies (and Lower)may however
Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad
Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce
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