Electronics Forum | Wed Feb 05 15:11:10 EST 2003 | davef
Russ, Jasper, et al; J Dumont is probably not as BIG of a dirtbag, as he / she appears. Please contact Brian Doyle [ bpdoyle@smtnet.com ] and complain about commecial postings.
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Thu Jul 22 12:05:33 EDT 1999 | John Thorup
| | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | |
Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey
| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |
Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones
| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e
Electronics Forum | Tue Apr 04 10:18:58 EDT 2000 | Russ
Brian, I agree with Jesper, You seem to have a PCB supplier problem! The conditions that you are processing your assembly with are nothing unusual and in fact very standard throughout all of the manufacturing facilities that I have been in, unless
Electronics Forum | Thu May 09 13:49:24 EDT 2013 | davef
First, it appears that your solder mask and your coating material appear to be incompatible. Second, IPA leaves a residue that's probably not compatible with your coating material, either. IPC-HDBK-830 - Guidelines for Design, Selection and Applic
Electronics Forum | Thu Sep 30 07:03:05 EDT 1999 | Scott Cook
| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Mon Sep 13 04:37:22 EDT 1999 | Brian
| I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects on
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