Electronics Forum | Wed Nov 07 18:37:27 EST 2001 | steven
sometime hand solder can cause also. no necessary have to be paste n reflow.:) now i'm facing bridging on 0402 components pads. any suggestions on spacing distance as we're going to re-design the pcb.
Electronics Forum | Tue Jun 02 17:32:53 EDT 2015 | jldowsey
Les, Some of the answers to design or stencil aperture/placement machine depend upon what is the current spacing between your components which you didn't specify. Chip components such as 0402's and 0201's typically have very small reductions in pas
Electronics Forum | Wed Nov 07 07:31:20 EST 2001 | steven
what is ideal or minimun spacing in between 2 pads to avoid bridging? thanks
Electronics Forum | Wed Nov 07 17:10:15 EST 2001 | davef
If you don�t paste / reflow solder on the pads, they will never bridge. ;-) A design with a 0.13mm gap between pads will challenge equipment, materials, and process.
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Tue Dec 14 12:41:56 EST 1999 | Kris W
Glen, Although the previous answers probably fit the problem you are having, we recently found that during pin insertion on an Autosplice machine, the gold was flaking from the pins and lodging between the legs of surface mount components. It would
Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef
Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar
Electronics Forum | Thu Jul 05 19:37:15 EDT 2007 | davef
We assume the three leads are lined-up perpendicular to the wave. Without taking corrective action, we know this: * 50 thou pitch will bridge * DIP do not bridge As a corrective action that doesn't invovle a respin of the board, decrease the solderm
Electronics Forum | Tue Jan 16 16:59:39 EST 2007 | realchunks
Pallet angle is usually pretty good. Lead length is also another good thing to keep as short as possible. Air Knives don't work that well. Also check your board. Make sure you have solder resist between each and every thru-hole pad. If the board
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