Electronics Forum: bridging qfp (Page 5 of 9)

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

Re: 45 Degree Wave Soldering

Electronics Forum | Tue Feb 23 11:09:12 EST 1999 | Steve Gregory

Hi Dave! Dat' be da same board we ran at NEPCON East in 97'! Ray Rua was running the TAC line then (his company usually runs the TAC line at almost all NEPCON shows). A couple of things I wanted to point out on that GIF image that might b

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C

Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind

HASL Plating Thickness

Electronics Forum | Tue Jul 27 11:34:05 EDT 2004 | C Lampron

Nippy, This is exactly what we are seeing. The exessive pads are all on one side of the board. This is a 10 up panel 5x2. All of the QFP's on one side on the panel are not releasing or are not gasketing and causing bridging. So the defects are rangi

blocking off stencil apertures with tape

Electronics Forum | Wed Oct 10 20:35:17 EDT 2001 | djarvis

Stephen, I don't understand this at all mate. 1. If you don't place a QFP and get bridging across the bare pads, you were gonna get absolutely horrendous bridging if you did put one down. That points to poor printer set up or stencil design or both

Which side of PCB should be prefered for screening...

Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake

Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas

World Class First Time Yield

Electronics Forum | Mon Dec 08 18:52:47 EST 2003 | Craig M

Stability of process is what your measuring so lets not assume a stable process(if your process was perfect you would have no defects). With no test a medium complexity board will be around 68.7% (according to Consulogic). I dont have many other sour

Solder briding on QFP

Electronics Forum | Mon Jan 11 14:51:11 EST 2010 | davef

If you don't have bridging between pads, how do know that you have a solder short, as compared with some other type of short?

Re: bare board problem

Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: gerber data vs bare board

Electronics Forum | Sun Sep 12 10:08:55 EDT 1999 | Earl Moon

| hello | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would they d


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