Electronics Forum | Thu Nov 04 19:55:49 EDT 2010 | eadthem
The best method i have for the few lifted/bent lead issues we have is i use a ic/bridge inspector with all its default options to check for bridges and solder at the tip. then i add a solder inspector but this time accrost all pins at the downslope o
Electronics Forum | Fri Oct 03 16:51:06 EDT 2008 | waveroom
If this is a one time rework might I suggest farming it out? 100pin QFP can be taken off no problemo.. Putting it back down properly and then hand soldering??? I wouldn't want that job. You need excellent placement and imaging and your not going to
Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson
On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik
Electronics Forum | Mon Oct 07 22:06:43 EDT 2013 | action_101
I successfully inspect solder on plcc's with angled cameras on the yestech we have. In the past I have successfully inspected for solder with angled cameras on mirtec machines for both plcc's and qfn's. Other than inspecting solder on those two types
Electronics Forum | Fri May 08 18:39:17 EDT 1998 | Steve Gregory
| | As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | | Any advice is appreciated. | | Greg Hi there Greg! First, I just gotta
Electronics Forum | Thu Feb 18 17:49:28 EST 1999 | Ryan Jennens
Hey all- My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with 89.5% metal
Electronics Forum | Fri Apr 13 22:56:02 EDT 2001 | gdstanton
I've been chipping away on a solder bridging and poor fillet wetting problem for a few weeks now (new to the company) and I found two issues. First, after a review of stencil inventory, I found apertures to be oversized when compared to suggested di
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Wed Apr 21 02:53:33 EDT 1999 | Raul N.
25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
