Electronics Forum | Thu Jun 30 13:07:56 EDT 2022 | emeto
I have used Bi based solder pastes before. What I can say about them is that they are brittle. Joints were cracking easily. This product is something new on the market, so it might be better. Keep in mind to test it for dropping and vibration and joi
Electronics Forum | Fri Jul 30 09:59:10 EDT 2004 | Steve
Excessive Time above Liquidus will cause a solder joint to become extremely brittle. Any shock or stress to the joint can lead to a failure.
Electronics Forum | Wed Dec 14 08:58:27 EST 2005 | russ
We experienced brittle solder joints that did not withstand thermal cycling as I was told. I am positive about the fractured joints but was informed by customer that it was thermal cycling of the part when they failed so they were latent failures.
Electronics Forum | Mon Jan 15 08:54:40 EST 2024 | SMTA-64304553
Trying to understand the impact of iron contamination above IPC recommendations (0.02%) on selective solder joints. Brittleness and discolouration are known but are there other factors that should be accounted for?
Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator
I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS
Electronics Forum | Fri May 03 16:06:44 EDT 2013 | hegemon
To be short, no change in profile is going to get you through this. As I recall the point of hard gold is to retard the wetting process, so no surprise here. For example a connector might have hard gold plating at the mating surface, but not at t
Electronics Forum | Mon Apr 16 11:58:07 EDT 2007 | cingsman
I believe SAC305 will result in a lesser amount of Ag3Sn inter-metallic compounds being formed along the joint boundary and in the sphere. Studies have been shown to point out a significant difference between the number and size of Ag3Sn plates in SA
Electronics Forum | Fri May 24 09:16:36 EDT 2013 | grahamcooper22
you need to reduce your time above liquidus to as low as you can...maybe 10~30 secs to allow the solder to wet to the gold but minimise the amount of gold that is dissolved into the solder joint...try also reducing the peak temp to 200~210 deg C. Thi
Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
