Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | Wed Jun 07 11:25:23 EDT 2000 | Dave F
In the portion of Chapter 1 on Flip Chips, Ken Gallio states (1.8.2.1) "tin/lead solder leaching or dissolving gold and form metal compounds, called dendrites, that greatly reduce joint reliability because of high brittleness." What is the compositi
Electronics Forum | Tue Apr 17 09:54:49 EDT 2007 | patrickbruneel
The only way to resolve these issues is to bring back the good ol� lead and make the joints ductile instead of brittle for an affordable price. Thanks for the link Dave
Electronics Forum | Tue Jun 19 19:03:31 EDT 2007 | diesel_1t
Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard BGA solder issues, by the other hand; you might be experiencing wicking due to heat is being absorbed on component so the balls on BGA are hotter than
Electronics Forum | Mon Dec 13 00:05:28 EST 1999 | Dennis O'Donnell
I can't figure out why everyone is plating everything with gold. According to the J Standard, gold plating should be removed before soldering to the surface. The gold, when left on the surface to be soldered will contaminate the solder joint and ca
Electronics Forum | Tue Jun 06 14:31:42 EDT 2000 | Jeff Sanchez
I have 25#'s of bismuth in my shop. I wanted to add some to my 63/37 till it was eutectic. This would allow me to lower the waves temp. Can I do this and still meet standards? Also would it make the solder joints to brittle and would discoloration be
Electronics Forum | Fri Aug 21 14:38:00 EDT 1998 | Earl Moon
| It's been one hell of a week.... | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | thanks | -Ben Right on. Yago sangria. Chili conceso. That'
Electronics Forum | Wed Aug 26 00:16:08 EDT 1998 | Jeff Sanchez
| | It's been one hell of a week.... | | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | | thanks | | -Ben | Right on. Yago sangria. Chili conc
Electronics Forum | Tue Jul 15 16:30:57 EDT 2008 | boardhouse
Hi Aj, Recommended Immersion gold thickness would be 3-5 Micro inches over 140 -200 micro inches of Nickel. Thicker Immersion gold than 5 micro inches can cause solder joint embrittlement. Gold readily dissolves in molten solder and will be present
