Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko
Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid
Electronics Forum | Tue Apr 13 09:11:54 EDT 1999 | Dave F
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Thu Apr 22 17:19:57 EDT 1999 | JohnW
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS
Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a
Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS
Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Thu Apr 22 16:07:36 EDT 1999 | Rick
| | Do solders exist that are both lead-free and low-temperature (e.g. 100-170 Celsius range)? If so, who supplies these materials? Any websites or contact information would be most helpful. | | | | Also, I am not an expert on soldering, so any
