Electronics Forum | Thu Jan 08 15:49:10 EST 2015 | emeto
I bet you that the problem comes from the ENIG brittle solder joints. About low temperatures I think you can go to the absolute 0 and the device should still work.
Electronics Forum | Fri May 31 10:15:30 EDT 2019 | davef
Major sources of crack in the solder connection after thermal cycling are: * Thermal heating caused by differences in thermal expansion between the board and the component * Lead-free solder is more rigid and brittle than eutectic solder in simila
Electronics Forum | Wed Nov 06 03:51:28 EST 2013 | cuperpeter
Hi rob, Thank you very much for your response. Profiling was made exactly on the pad, which showed dewetting, so the values are mentioned for this pad. PCB's is about a week old. It is possible that the surface of pads is already oxidized? I will t
Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto
If there is a way to pre-tin the parts, that might help in forming better joint with gold.
Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef
Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
Electronics Forum | Thu May 26 21:09:01 EDT 2005 | thaqalain
The reliability of a Gullwing component solder joint is in question when insufficient solder is evident: *at the heel of the lead *at the toe of the lead *none of the above
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 12:04:45 EST 2002 | dason_c
You can use the IPC-7525, Stencil Design Guidelines for start up.
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