Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
Electronics Forum | Thu May 18 20:42:36 EDT 2006 | davef
Hypothesis #1: We agree with Steve. You are probably seeing the nickel underplate. The gold was absorbed into the solder in portions of a second, so that you don't see it is not surprising. We're guessing that the gold was porous and allowed the n
Electronics Forum | Sat May 27 08:58:07 EDT 2000 | Thanas
Hi, I'm new in SMT & confusing to define the soldering defect criteria of cold solder, dry joint & dewetting. & what's the root cause for them ? FYI, I had read the IPC-A-610 rev. B , but doesn't help much. Any advise is very much appreciate. Thanks
Electronics Forum | Wed Mar 30 16:07:24 EST 2005 | Dreamsniper
If there's no shear strength standard for solder joint, how will I define my pad width and length then. I have a 8.5 mils width and my component lead width is 8.66 mils based on manufacturer's minimum width specification. How will I identify that it
Electronics Forum | Mon Oct 18 11:01:26 EDT 2004 | DenisM
I have had similar problems and my customers have had this too. A two story drop test was made by one of my customers and they found that changing Sn63 solder to Sn62 solder made a significant impact. There is no real downside other than a slightly
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Thu May 18 09:40:08 EDT 2006 | russ
Good post WML! you helped a lot!, Chunks brings up good point. Are there vias that can be shorted by this component being slightly misaligned? When reworking there could be residual solder or even flux that has shorted the pads or component, etc.
Electronics Forum | Sat Feb 10 09:29:08 EST 2007 | davef
NASA requirements may be a good starting point http://www.hq.nasa.gov/office/codeq/solder.htm
Electronics Forum | Fri May 31 23:48:14 EDT 2019 | dhanish
Thanks Dave..My customer proposing to reduce the solder volume.Can the TCT be improved by reducing the stand-off height?
Electronics Forum | Mon Jun 24 23:21:27 EDT 2019 | sssamw
You may need tell us the background, how PCBA being tested, the test setting and spec. Solder crack maybe due to CTE mismatch or mechanical strain.
