Electronics Forum | Wed Mar 30 16:46:03 EST 2005 | chunks
There is no spec because solder is designed to provide an electrical connection not a mechanical connection to hold the part on. If it where mechanical we�d be welding our parts on. Your pad width and length are derived from your component manufact
Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef
A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A
Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Thu Mar 24 19:19:17 EST 2005 | EA
Hi davef, Appreciate your advise......
Electronics Forum | Wed Mar 30 14:16:42 EST 2005 | chon
Davef That's why I mentioned that this was the "Closest" written procedure I've found related to this type of tests.
Electronics Forum | Sat Jun 01 04:22:24 EDT 2019 | gregoryyork
Depends on lead free alloy choice as well
Electronics Forum | Tue Mar 22 03:23:10 EST 2005 | EA
Hi, We are trying to break a component ( SMT component ) off the printed circuit board and measure the quality of the solder joint. But, after breaking off and having the reading, we do not know whether the reading is it within the component specifi
Electronics Forum | Tue Mar 22 07:39:05 EST 2005 | davef
There is no standard. This is a relative test. If you wish to do tests of this kind, we suggest to pay attention to the following points: * Shear strength of soft solder depends on the deformation speed applied. The faster the material is deformed t
Electronics Forum | Thu May 18 14:30:33 EDT 2006 | Chunks
Hi Mark, I feel like a broken record since I keep replying to this thread. BUT, I remembered a large lytic cap that we had a couple years ago, doing the same thing. The base of the cap would expand in reflow and the bottom would bulge out and only
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
