Electronics Forum | Wed Oct 06 22:55:14 EDT 2004 | davef
Your customer is correct. Components should not fall a board during a reasonable drop test. A shear test poorly represents a drop test. A drop test represents a drop test very well. If you want to proceed with shear testing, search the fine SMTne
Electronics Forum | Sat Jan 01 10:14:30 EST 2005 | davef
East coast, solder connection failure analysis labs in the vacinity of New England are: * American Competitiveness Institute, Electronics Manufacturing Productivity Facility, One International Plaza - Suite 150, Philadelphia, PA 19113(610) 362-1200 F
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Wed May 17 12:08:04 EDT 2006 | Mark
Hello, I have recived from customer PCB where he found that big SMD electrolytic capacitor just fell off. I checked this boards (FR4 , Au/Ni coating). I noticed that all solder remained on the termination of capacitors and looks ok but on the boar
Electronics Forum | Wed May 17 13:07:09 EDT 2006 | Chunks
I would suspect touch-up/repair, unless all your caps are falling off. I know our operators use two irons to solder both sides at the same time. If it's not flay and square, yo may get the defect you are talking about. Another area is co-planari
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Wed Sep 15 23:00:36 EDT 2004 | pdeuel
if opens in same aria check for mask to via coverage for that pad. We had vias pulling solder from pad. We did not have totally opens but capalry from via was as strong as capalry to ball / pad creating small joint aria.
Electronics Forum | Mon Jun 18 13:33:46 EDT 2001 | nifhail
Thanx Dave. What about the ball park figure for 20 & 16 mil pitch pull strength. Appreciate your input and thank you in advance.
Electronics Forum | Thu Feb 24 19:58:35 EST 2005 | abhirami
GS, What should be the temperature we should get down to? Is it room temperature? Then it could be quite a long time. Eutectic solders cool down below 183C and may be cooling to 100C should do good? What do you think?
Electronics Forum | Wed May 17 21:17:07 EDT 2006 | mumtaz
Chunks learn to spell first, then you can place blame on the operators. That's all yu do - blame operators. Get the facts first, even we know how to do that.
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