Electronics Forum | Mon Feb 02 22:01:24 EST 2004 | Dean
I find this disturbing when customers dictate your process and equipment? Your responsibility is to deliver a quality product on time. Why would your customer care HOW you achieve this? Hence the success of Chinese manufacturing. I have one custo
Electronics Forum | Mon Jul 14 22:40:45 EDT 2008 | edmaya33
hello Dave, thanks for the references. i will try to compare the results in 3 months interval.
Electronics Forum | Mon Jul 14 07:49:50 EDT 2008 | edmaya33
Do we really need to follow the IPC J-STD-001 Solder purity? If so, how to effectively balance the chemistry of Sn63/Pb37 other than adding a pure tin on the solder bath? Is this really needed to monitor in monthly basis?How many kgs of pure tin pe
Electronics Forum | Mon Jul 14 09:41:35 EDT 2008 | davef
Q1. Do we really need to follow the IPC J-STD-001 Solder purity? A1. Yes, you should control impurities in solder. Further information: * "Allowable concentration of contaminating elements in solder: impurities are harmless unless their level goes to
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Electronics Forum | Mon Nov 12 06:05:15 EST 2001 | nop_e
Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.
Electronics Forum | Mon Jan 15 18:24:40 EST 2007 | greg york
probably volatiles in the joint outgassing as it comes over the wave, is the joint a yellowy colour as well, or any pictures we can view cheers greg
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Fri Jan 12 15:50:51 EST 2007 | pyro747
Hello all, We have resently run across a solder joint from a through hole part that looks to have a wrinkle effect (star look) from the wave? No pattern it just happens here and there, and some of the joints on the same row look smooth and good. Any
