Electronics Forum | Wed Jan 07 17:34:52 EST 2015 | duchoang
Customer puts our board to thermal test. Test cycle is -55c to 85c, repeat cycle in 15-20min. After 600 cycles, lot of TSOP joints are cracked, leads lifted. There are reasons such as thin PCB, mechanical impacts, warped PCB... My question is, how lo
Electronics Forum | Tue Dec 23 01:25:38 EST 1997 | J.H Kim
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly.
Electronics Forum | Wed Jan 07 17:39:26 EST 2015 | duchoang
Additional info: I use SAC305 solder paste on Enig PCB.
Electronics Forum | Fri May 23 23:20:55 EDT 2003 | jedduan
What's the resistance value level of lead-free joint?Could anyone share me with the information? Thanks in advance Jed
Electronics Forum | Tue May 27 21:07:41 EDT 2003 | jedduan
Thanks Dave. It's very nice of you. Jed
Electronics Forum | Thu May 29 09:10:10 EDT 2003 | caldon
Dave- Thanks for the NIST Site.....Again, another useful nugget!!! Cal
Electronics Forum | Sun Dec 28 05:31:59 EST 1997 | Bob Willis
We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk | | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection |
Electronics Forum | Fri Jan 12 17:33:56 EST 2007 | John S.
I've not seen it on a solder joint, but I've seen it on an SMT pad that had been skipped in a wave solder operation. The boards were under inspection for poor solderability. We never really pinpointed the cause. It would make a perfect 6 pointed s
Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i
Electronics Forum | Sun Sep 17 02:48:41 EDT 2006 | Eric
Anyone know any international standard (e.g. IPC, JIS) for the SAC lead free solder strength ? If no, any industrial / company standard for it ? Besides, any mathematical model which can help to calculate it.... express in "Force / area "
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