Electronics Forum | Wed Jul 24 07:18:12 EDT 2002 | lloyd
Hi, We occasionaly have problems with some of our panellised boards breaking away from each other. The section joining them is very small and makes the assembly weak. The boards are normally broken off during our through hole process (bad handling)
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
Electronics Forum | Wed Feb 05 11:38:46 EST 2003 | Stephen
Don't forget placement. I"ve seen chips broken when they are being placed because they were thicker than the parts data used for them. This is not an issue on Panasonic machines because they measure the thickness of parts but I have seen it happen
Electronics Forum | Tue Jul 03 11:30:18 EDT 2012 | davef
Just so that we both on the same page: * When you "reflow the chips on the broken board," what do you actually do? How do you do it? What kind of controls do you use? * When someone "did a reflow on the south bridge chipset," what do they do?
Electronics Forum | Wed Jul 18 02:19:50 EDT 2007 | vijayanandh
PANASERT MViiF --> PANASERT MSF --> BTU Reflow Currently we're facing massive problems with MViiF(chip shooter) nozzles being damaged and broken. Anyone around who is facing the similar problems? We're looking into the feeders (worn out base/problem
Electronics Forum | Fri Nov 21 16:48:05 EST 2008 | kennyg
Anyone have an 'easy' solution for reducing PCBA handling damage. I'm fighting low level chipped, scuffed and broken-off SMT parts. The damage is spread out across different areas of the assemblies. The assemblies are double sided SMT with 0402's
Electronics Forum | Tue May 25 07:03:34 EDT 1999 | Milan Z.
After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) Where is the problem? Thanks in advance!
Electronics Forum | Tue Jan 24 21:15:07 EST 2017 | david_chiu
I have met the same issue before. 1st possible root cause: The dimensions of reel's each chip inserting hole are a little bigger. You need to see if the turn over issue are all happened in the same vendor's reel material. 2nd possible root cause: The
Electronics Forum | Wed Sep 09 21:20:26 EDT 1998 | Simon Ting
hi, 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of epoxy,
