Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong
Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta
Electronics Forum | Tue Dec 21 20:05:01 EST 1999 | Chris
Try Flip Chip Technologys. They have several daisy chain flip chips. One is called FP250. .250 X .250 solder bumped flip chip. Try Technet too. Remember seeing several other manufactures of daisy chain die. Maybe Unitive at www.unitive.com can
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Wed Dec 29 18:01:13 EST 1999 | JAX
What's happenin Larry, I am not sure if bump proccess E is available on this particuliar software rev. but I have forgotten?????? It shouldn't matter; bump proccess A will work fine. The only things you have to do is make sure the pick up point
Electronics Forum | Tue Feb 02 21:55:20 EST 1999 | Jon Medernach
Chris is correct. You will have a problem if you do not have the right metalization under your bump. The BM is critical, it is defined by the passivization layer on top of your die much like a solder mask defined interface on FR4. You will find mos
Electronics Forum | Wed Oct 07 15:25:02 EDT 1998 | Joe P.
Hi Everybody | | Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. | We have alread
Electronics Forum | Tue Apr 24 10:05:09 EDT 2001 | Robert Steltman
Help please.... We have just run a prototype board using a number of BGA devices on it. The corners on two of the BGA's (PBGA357) seem to be higher than the centre of the device. ie the outer bumps seem to be "stretched" compared to the centre bumps
Electronics Forum | Thu Sep 02 21:19:25 EDT 1999 | NAZEEH CHAUDRY
| | Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | | | | Insufficient solderpaste. "No flux" (sat too long after print). | | Those are what I've experienced. | cbga or pbga if pbga check thermal prof
Electronics Forum | Mon Apr 01 23:16:44 EST 2002 | dwoon
Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation. Does anyone has experience in actual production run? What is the possible effect for
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