Electronics Forum | Tue Feb 17 01:12:52 EST 1998 | J.H. Kim
In solder bumping in flipchip technology by splder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks
Electronics Forum | Tue Feb 17 01:15:26 EST 1998 | J.H Kim
| In solder bumping in flipchip technology by solder printing, | the precise control of solder volume and height is very difficult. | Therefore I'd like to know the solution of this problem. | Thanks
Electronics Forum | Wed Aug 22 14:24:39 EDT 2001 | markhoch
I used a CamAlot 5000 to apply conductive epoxy on an aluminum substrate about 4 years ago. I used the largest diameter nozzle CamAlot had, and I bumped the dispense and dwell times way up. It was the slowest stage in the process, but it worked out o
Electronics Forum | Mon Sep 24 18:00:58 EDT 2001 | jagman
Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
Electronics Forum | Mon Oct 22 15:30:57 EDT 2001 | Basaran
Is there anybody in this forum who is using TI DSP 320C6203 modules for communication devices. I would like to know if anyone has problems with Solder bump- Ni pad interface delamination or problems with signal quality.? Cemal Basaran
Electronics Forum | Mon Apr 01 13:00:27 EST 2002 | BTaylor
We had a problem with conformal coating getting under an IC and with Temp. and vibration would cause cracking of the solder bump, underfill solved the problem.
Electronics Forum | Mon Jan 16 16:21:50 EST 2006 | slthomas
Someone probably did a search and replied w/o looking at the date. What I noticed is that some threads get bumped to the top with new posts and some don't. Strange.
Electronics Forum | Fri Jan 14 17:09:21 EST 2005 | Bob R.
Whether or not conformal coating creates a reliability problem if it bridges the gap between the board and bottom of the part depends on the properties of the coating. A low modulus coating is fine, but one thats modulus increases at colder temperat
Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris
the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum
Electronics Forum | Thu Oct 06 08:55:05 EDT 2005 | stepheniii
If a rubber squeege is bumped on the edge, no biggee. But you have to be carefull the metal ones don't get dinged. All it takes is a little extra care but if your operators are used to handling the rubber one they might not increase the amount of c
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