Electronics Forum: burn flux inder bga (Page 1 of 2)

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

Long Soak Times for BGA soldering?

Electronics Forum | Fri Jul 02 11:17:09 EDT 2004 | jdumont

I agree, the flux will probably burn off before it gets to do its job. Def not a good idea....

Recommended max board temp for BGA repair

Electronics Forum | Wed Aug 10 17:02:32 EDT 2005 | Inds

wats the thickness of your board.. and the dimension.. I would not heat the board beyond 150deg C.. coz if the board is thick and large.. it will take a long time to reach that temp..and you will burn off your flux.causing poor solder joint. Ind

Excess Flux in uBGA rework

Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman

If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle

BGA solder bridge - Adding Pictures

Electronics Forum | Fri Mar 04 01:08:19 EST 2011 | kemasta

Thanks davef Bridging:- There is no heat sink on the BGA, the heat sink will be fix after relow. I do believe paste had something to do with it, but currently this defect didn't appear so oftenly, so we think that the main root cause is not from the

Pb-Free BGA on SnPb Assemblies

Electronics Forum | Thu May 01 10:51:09 EDT 2008 | realchunks

You need a paste designed specifically for this. They are available. Most have 2% silver in them and higher temp flux so you can reflow at "no-lead" temps. The silver aids in the intermaetalic bond and the high temp flux allows you to reflow the n

BGA failure at Functional Test

Electronics Forum | Fri Jan 16 14:42:44 EST 2009 | realchunks

Kester R562 is a 63/37 paste. Not ideal for no-lead parts. I bet you are seeing no-lead BGAs and they will become very weak using your old proile and paste (been there - done that). You can try a hotter profile but will probably just burn off your

BGA inspection microscope

Electronics Forum | Tue Dec 06 15:27:36 EST 2005 | Mike

Steve, You are correct in that X-Ray image of a BGA will not show flux residue. So what? If you are using no clean flux then I would think it doesn't matter if there is some flux residue. Sure if you are reworking a BGA and the operator dumps t

Excess Flux in uBGA rework

Electronics Forum | Tue Sep 25 14:38:05 EDT 2001 | nwyatt

1. SRT has been recently calibrated - problem is too many hands in the machine and careless mistakes. The profile is good and has been recently checked by a fellow from Genrad. 2. We are relying on the left over solder from the previous joint and

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip

Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least

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