Electronics Forum | Tue Sep 26 18:06:13 EDT 2006 | russ
could be black pad, or it is just bad reflow profile that did not get all balls soldered down. OR it could be a planarity issue between BGA and fab during assembly. Can we assume that this is proven design? Somewtimes in new design touching a BGA
Electronics Forum | Thu Dec 28 16:17:23 EST 2006 | joey_dragon
Good tidings, all. I am looking for a machine that will allow us to mount a flat flexible strip (such as TennRich's B.Type) to a row of pads on a PCB. I have not much knowledge about the process, I guess I expect to see a machine with some hot bar.
Electronics Forum | Thu Dec 28 22:58:30 EST 2006 | davef
If this is same TennRich Type B [ http://www.tennrich.com/trtw/TR_PI_Prod_Info.php?pid=2 ] that is an EMI gasket, it needs to be glued with a conductive adhesive. It has the same thermal capability as a Snickers Bar, about 90*C top end.
Electronics Forum | Fri Dec 29 08:14:19 EST 2006 | joey_dragon
Thank you for the quick reply! Actually, the "type B" I referred to applies to a flex cable that can be found in this page: http://www.tennrich.com/trtw/cabling_3.php It is a reverse Engineering project and, from what I can see, there is, indeed,
Electronics Forum | Tue Jan 16 10:45:36 EST 2007 | PaulD
Im looking for some help I have a tp18 that will not initiate the error is f-mot1-38-245:msetdynx I tried several things. I've swapped mot cards to not avail, checked the long ribbon cable and so forth if anyone knows what this code means it would be
Electronics Forum | Thu Oct 08 08:15:39 EDT 2009 | kpm135
We've used both 1A33 urethane and 1B31 acrylic coating on our SMT assemblies with great success for many many years. This is with components of all shapes and sizes including a 9 ball micro-BGA. We apply the coating in every way imaginable and we hav
Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg
Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would
Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef
We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate
Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef
Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot
Electronics Forum | Wed Dec 27 13:16:12 EST 2006 | Cmiller
You should be able to trim the crimp part of the contact then just solder the wire onto the terminal.
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