Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Tue May 28 13:14:31 EDT 2002 | zanolli
Hello Mark, I'll assume that you are currently wave soldering and would like to eliminate that operation by using pre-forms or press-fit connectors. Solder preforms or solder flux bearing connector leads usually do not require any hole size changes,
Electronics Forum | Sun May 28 08:24:50 EDT 2006 | Sjm
I read about 10:1 , 6:1 aspect ratio but I don't understand how it works. Can someone explain how you figure out the aspect ratio on a design with a board thickness of .093 and via hole size of .010 I don't know how to get the 6:1 number Is it the b
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F
Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�
Electronics Forum | Tue Dec 10 10:26:56 EST 2002 | davef
Questions are: * What is the current plating on the connector that is over the "plating of the leads is Nickel (99.9% purity)"? * What are the temperatures and durations at those temperatures that you read on these connector leads? * What solder allo
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Sat Apr 26 20:27:18 EDT 2003 | LWEI
I'm working on a protobuild for a pcba. THis pcba uses double-reflow, paste-in-hole process. On bottom side there is a Ceramic BGA, size 35 X 35 mm, thickness 6mm, over 900 balls count (ball pitch 1mm)and it weighs a hefty 20 grams. Printing uses 6 m
Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781
Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has
