Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F
Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�
Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se
First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save
Electronics Forum | Fri Sep 25 16:38:56 EDT 2009 | esoderberg
empf issued an excellent study of calculated solder volume in the 90's. It used lotus 123 but is easily used in excel. I have used it for over 10 years. The only thing wrong is with leadless components. the amount of paste required generally is insuf
Electronics Forum | Tue Sep 22 10:05:00 EDT 2009 | roland_grenier
Does anyone know how to calculate solder paste volume required to run a PCBA on an SMT line? I'm looking for a solder paste volume model which include paste waste. Roland
Electronics Forum | Wed Jan 16 12:04:45 EST 2002 | dason_c
You can use the IPC-7525, Stencil Design Guidelines for start up.
Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef
No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.
Electronics Forum | Thu Apr 15 10:05:26 EDT 2010 | davef
Why not use the same paste volume as you currently use? Alternately, although we haven't used it in a while, doesn't IPC have a very nice paste volume, aperture calculator that could be used for this? Or is it just a pad size calculator used for
