Electronics Forum: can (Page 208 of 2413)

Cradle to Grave Part Tracking

Electronics Forum | Sun Feb 14 15:43:32 EST 2010 | jlawson

ERP/ MRP systems can do basic traceability but often fall through as make a lot of asumptions and can not capture realtime info and account for all possible situations. I have seen alot of companies do this and there is always a 'shoe horned' system.

Strange things ocuring during reflow...

Electronics Forum | Sun Feb 21 13:01:18 EST 2010 | davef

Dean: Are there limitations to the size or configuration of component that can be retinned and rereeled?

Converting Thru Hole to SMT

Electronics Forum | Wed Mar 17 10:55:41 EDT 2010 | eezday

call me at 631-258-3064 and I can help

second side reflow of MSD parts after wash

Electronics Forum | Wed Mar 24 17:09:34 EDT 2010 | davef

RE Search: Search can be tricky. Try MSD and wash

To reduce the dross formation in wave soldering process

Electronics Forum | Sat Apr 24 08:37:07 EDT 2010 | sudhir14

HI, Can pl. provide the some detail on recomanded pump speed

philips Eclipse-II

Electronics Forum | Fri May 14 11:14:57 EDT 2010 | thanh

wow, no one can figure out why it doing that????

How to use solder paste for thru holes

Electronics Forum | Fri May 14 15:27:00 EDT 2010 | thanh

most of thru-hole components can not handle the heat through the oven. they will be burn.

Solder Clogging

Electronics Forum | Sun Jul 04 21:22:02 EDT 2010 | adhesivedispenser

Hi for you question we may can hlep you.

BGA Solder Voids

Electronics Forum | Mon Jun 14 12:22:24 EDT 2010 | chrisatae

What can I do to reduce BGA solder voids?

fod checks

Electronics Forum | Mon Jun 21 02:38:06 EDT 2010 | joseph_smile

Hi can any one show me fod identification,controling check list? with regards JOSEPH


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