Electronics Forum | Wed Sep 22 15:33:54 EDT 2010 | davef
Comments are: * First, no one is looking at your posting. You need to post in the 'SMTnet Production Forum' [top of the page]. This 'SMTnet Site Support Forum' is for whiners that want to complain to Neil about problems in logging-in, font that's to
Electronics Forum | Wed Sep 29 16:04:29 EDT 2010 | hegemon
In my experience, the best way to do a lifted lead inspection on a QFP is by laser height measurement. It is very difficult to consistently catch a lifted lead with only a top down camera. As you say, too many false calls, and still some escapes.
Electronics Forum | Thu Nov 04 19:55:49 EDT 2010 | eadthem
The best method i have for the few lifted/bent lead issues we have is i use a ic/bridge inspector with all its default options to check for bridges and solder at the tip. then i add a solder inspector but this time accrost all pins at the downslope o
Electronics Forum | Wed Oct 13 06:20:00 EDT 2010 | costache
Dear All > > I need to check the solder paste > volume inside the PTH at our board,which size is > 440x620 mm.So, I may need 3D inspection > machine,AXI, not AOI.So, does anyone recommand me > which 3D machine is suited to my PCB? Thanks in > a
Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar
Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab
Electronics Forum | Tue Jan 11 13:12:58 EST 2011 | methos1979
Has anyone had any luck programming using the side cameras to inspect for defects on the sides of chip components? We recently had an escape of a damaged chip capacitor that was impossible to see from the top camera but was clearly visible with the
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Electronics Forum | Fri Nov 19 13:07:01 EST 2010 | vmorina
Hello everyone, Talking to my boss today I was able to determine what we're really looking for in terms of reflow soldering. The company is not looking to do a volume run; we're trying to solder chips for prototype boards, which are currently done w
Electronics Forum | Thu Dec 16 15:06:32 EST 2010 | rway
I would go with AOI. Reasons are: --AOIs are faster --They have more coverage. Given, you cannot test the value of components, but the AOI will ensure that all resistors are correct, orientation of ICs are proper and components are present on the
Electronics Forum | Tue Nov 30 11:42:03 EST 2010 | hegemon
A simple question with very complex answers... But to simplify, you could start at this. Water soluble fluxes are cleaned using (typically) de-ionized water, using a spray wash method. Sometimes a saponifier is added to the water to help it get
