Electronics Forum: can aoi detect cold solder joint (Page 1 of 19)

aoi

Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske

In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t

facing cold joint problem

Electronics Forum | Sun Jan 18 10:13:59 EST 2004 | davef

Materials added to solder can change its appearance. For instance: * Gold in tin/lead solder is dull / grainy * Palladium in tin/lead solder is dull / grainy We do NOT advocate using visual appearance to define the appearance of a good and a bad so

cold joint on 1 lead of IC

Electronics Forum | Thu Feb 08 08:15:28 EST 2007 | tjcrume

I have received 10 customer returns for a cold solder joint on 1 lead of a 36 pin IC. Everytime it is on the #18 pin. The process is reflow and I can't figure out why the one leg is cold and the other legs look OK.

cold joint on 1 lead of IC

Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval

A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'

Re: Insufficient solder joint

Electronics Forum | Tue Dec 14 11:08:59 EST 1999 | Wolfgang Busko

Hi Paul, you got to find the reason first before any measures can be taken. You have to determine wether it happend somehow at your site or at the boardhouse, you can�t blame them without reason. As long as it is suspected that more of those panels

BGA solder joint integrity

Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain

Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly

BGA open joint

Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W

Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se

Re: Solder joint criteria

Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F

Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c

Aluminum Capacitor disassociated from sodler joint

Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto

Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a

Ceramic + Hi-temp solder

Electronics Forum | Wed Apr 21 12:03:59 EDT 1999 | Michael N.

I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is about

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