Electronics Forum | Thu Mar 18 18:40:15 EST 1999 | Marc Ruggiero
| | | Hi folks, | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volum
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Fri Jun 01 12:23:22 EDT 2001 | medernach
I've had good and bad experiences with OSP's. First of all, ask yourself, "Why use an OSP?" If you don't need it, don't use it. Solderability is dependent upon the number of thermal passes (the fewer, the better), the thickness of the coating, the
Electronics Forum | Fri Mar 19 07:24:38 EST 1999 | John
| | | | Hi folks, | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and
Electronics Forum | Mon Mar 22 18:03:15 EST 1999 | Marc
| | | | | Hi folks, | | | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diamet
Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C
| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Fri Feb 13 09:17:11 EST 2004 | Kris
we are worried about the coating not being able to cover underneath the BGA. If the coat is excessive then it would cause CTE issues. Also if anybody has data on 85/85, 1000 hrs after conformal coating of BGA, would appreciate if you guys can share
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
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