Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk
Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Wed Feb 15 08:47:09 EST 2006 | pjc
Yes, doing the DoEs on your wave to achieve optimum settings that deliver the best results on your worst board is correct method. If not clear on the process, there are still wave solder process classes out there you can attend or hire in-house. If y
Electronics Forum | Wed Feb 15 19:20:46 EST 2006 | Mr. Samir
Russ, On both instruments, I ran them through the wave 20 times each using identical profiles and wave parameters, and then used statistical formulas to measure the variation and repeatability of each. I had these all in Excel, but that was around 1
Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
Electronics Forum | Tue Jul 19 09:18:14 EDT 2011 | davef
Could this be an opportunity to explore the use of cartridge-type paste dispensers? Or maybe a reason to keep working over the weekend. * Re-Storing & Re-Using “Used” Solder Paste. Though not a recommended practice, used solder paste from the stenci
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