Electronics Forum: cannot (Page 51 of 126)

DEK�s HawkEye

Electronics Forum | Mon Jan 30 10:21:05 EST 2006 | CEB

Just recently installed new machine with Hawkeye 400, the vision system is extremely easy to set up and run. We have only been running but 6 weeks, but I would recommend the system versus the cost of a inline solder paste inspection systems. If you i

Working with Lead free and Pb Capacitors

Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95

Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.

Internal Oven Calibration

Electronics Forum | Fri Feb 10 12:33:36 EST 2006 | russ

We do something quite simple that may or may not be adequate but I cannot think of why it would not be adequate. If anybody can please inform. We have a large board about the samer width as our oven. We have dedicated thermocouples on this board a

Solder paste Thawing

Electronics Forum | Tue Feb 14 09:30:42 EST 2006 | cyber_wolf

Pardon me for being so bold, but I still cannot understand to this day why solder paste thawing is an issue. I am not sure what types of paste you all are using but it has been my experience that the only thing you gain by refrigerating is 3 months

stepped stencils

Electronics Forum | Fri Feb 24 08:29:25 EST 2006 | davef

Step stencils are not widely used, due to: * Higher cost as compared to uniform thickness stencils * Danger of solder paste smearing at least close to the steps * Difficulty of cleaning the stepped stencil underside (the steps cannot be on the upper

Quad IVC 115 Component placement.

Electronics Forum | Thu Mar 02 08:37:15 EST 2006 | walbone

Thank you very much. I swapped the component length and width measurements in Autoprogram and it now places the SOT23's with image verification no problem. As for the 0402's I am still working on this. Pick and place is very new to me, well I start

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Tue Mar 28 17:10:25 EST 2006 | mikecollier

I unfortunately cannot post any photos, the unit in question is classified. And, as far as my comment that the BGA profile can be manipulated, if an engineer is also working the process with one of the operators, they can override the profile at any

BGA Rework

Electronics Forum | Tue Apr 25 16:42:00 EDT 2006 | russ

Sometimes you gotta do what you gotta do! We have to perform this on occasion as well. We perform this when we cannot get a board to stay free of tacoing, oilcanning, sagging or warping. (we needed a bigger preheater dimension wise) We have one no

IPC-A-610D Question

Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim

8.2.5.5 Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder

cleaning wave solder pallets

Electronics Forum | Tue May 16 15:30:07 EDT 2006 | George

Hi John, Are you talking about cleaning the pallets after running to store them? or during production? well in any case...I recently started to use this cleaning solution "Cybersolv" from Kyzen. It is water soluble and also can be used instead of IP


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