Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika
Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h
Electronics Forum | Fri Jul 13 12:20:33 EDT 2007 | jdumont
There are a lot of areas that could be leading to this problem. We have some of these issues on some boards with this solder as well but the hole fill still meets IPC class 3 requirement of 75% vertical hole fill. Through hole diameter is important.
Electronics Forum | Fri Oct 12 12:12:13 EDT 2018 | davidsmullins
We have some fairly standard 0.1" pitch, two row, shrouded, through hole headers soldered onto a thick backplane. There are tiny inspection holes along the bottom edge of the plastic body that allow an inspector to observe the top of the through hole
Electronics Forum | Wed Jun 27 13:55:10 EDT 2001 | peterson
We are having some difficulty achieving 75% fill on some through-hole power connectors. The board is very thick. Any suggestions? Our plan is to preheat extensively, pre-tin the leads and perhaps add paste in hole. Anything else that might achieve th
Electronics Forum | Tue Dec 17 17:47:49 EST 2002 | Tim Marc
Dave, I�m talking about the 75% vertical fill of solder IPC 6.3 criteria (B), and 6.3.1 Fig 6-5. I also referred to the annular ring of the Plated-Through-Hole, being coated with solder mask. Semantics, yes I did refer to the Plated-Through-Hole (Sup
Electronics Forum | Fri Jun 29 13:13:32 EDT 2001 | Brian W.
What workmanship standard are you working to? The IPC book has an allowance for boards with heatsinks or thermal masses that allow less than 75% barrel fill on through hole parts. I would suggest that you check your board layers and determine if yo
Electronics Forum | Tue Dec 17 11:01:24 EST 2002 | Tim Marc
Hello all, One of our PCB manufacturers coated a through hole connecters vias with solder mask. The only IPC references that comes close to describing this problem is 2.9.2 Registration to holes, and subsequent specification 6.3.1 PTH � Vertical fil
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Mon Feb 28 11:01:59 EST 2005 | jbrower
Hi Ing, Yes, slope of the conveyor is important. What type of assemblies are you having 50-75% fill on. Are they single sided? Plated through hole? Is this a recent problem? I'm more than happy to help, but I need more information. Best regards, J
