Electronics Forum: cant handle device (Page 2 of 43)

Air Moisture in Production

Electronics Forum | Thu Dec 09 10:40:45 EST 2010 | grahamcooper22

MSL 3 means you can have the devices open for a maximum of 168 hours in an atmosphere of less then or equal to 30 C and 60% RH. If the humidity is less then 60% then it means the devices will absorb less moisture in a given time, but even at 40% RH y

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob

@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil

footprint max505

Electronics Forum | Wed Mar 11 06:04:39 EST 1998 | WIM CLASSENS

I'm designing in a MAX505 but i can't find the footprint for this device

BGA Re-Balling services.

Electronics Forum | Wed Aug 29 04:29:17 EDT 2001 | brownsj

People. We have a Malaysian subcontractor who says that he can't find anyone to re-ball a 528 pin BGA device. Does anyone know of a company who can re-ball this device for them. Thanks for your help. Steve.

Re: MSD in asembly and rework

Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader

| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har

piece part handling

Electronics Forum | Wed Jul 02 14:25:14 EDT 2003 | Earl Wildes

Greetings. Does anyone know of a good reference on the proper physical handling of surface mount devices? We have a number of very small builds, so our stockroom is very often issuing single piece quantities. The parts are protected from ESD, but

ROHS procedure's for handling PCB, Moisture sensitive dev. etc.

Electronics Forum | Thu Sep 15 22:23:36 EDT 2005 | davef

Use your board supplier recommendations Specific procedure or guidelines that need to be followed for handling Moisture Sensitive Devices => J-STD-020 & J-STD-033 Is there any paste height/volume requirement for a lead-free process? => You need to

Re: Classification of moisture sensitive devices

Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F

| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that

Tantalum caps “popcorn”

Electronics Forum | Sat Apr 27 15:42:53 EDT 2019 | davef

Your ppl are correct, the capacitor is not sealed. So, it is perfectly acceptable for the capacitor to have absorbed moisture. If your ppl don't either prevent moisture absorption or remove the moisture prior to soldering, their component could fail

Question on J-STD-001B

Electronics Forum | Mon Mar 13 08:59:20 EST 2000 | Ashok Dhawan

I could not find a specific clause or section in J-STD-001B which can relates to special requirements in storage, packing and handling of Moisture sensitive devices per J-Std-033 / 786A /-022 . I guess the way ESD is relevant to electronics assemb


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