Electronics Forum | Mon Oct 10 09:42:43 EDT 2005 | Rob
Have you checked the devices to ensure that they are working correctly before assembly? They may also have not been handled or stored correctly before they reached you - especially if they are grey market stock.
Electronics Forum | Fri Aug 29 07:56:56 EDT 2008 | davef
Omid It depends. Follow the guidelines of ANSI/J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices. It's available on-line.
Electronics Forum | Mon Jul 15 15:02:55 EDT 2013 | island2013
In previous lives we vacuum sealed all MSD devices. Also a nitrogen chamber can be used for unsealed bags. You can check the J-STD-033 and J-STD-020A for handling of the different levels, bake times etc. Good Luck!
Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef
IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]
Electronics Forum | Tue Jan 19 10:23:23 EST 2021 | grahamcooper22
Do any assemblers use AVX FLEXITERM components ? Anyone experience any instances where the devices look to have soldered well, but then when handling the pcbs, and maybe with a little bit of pcb flex..the CHIPS just drop/pop out the solder fillets ?
Electronics Forum | Thu Aug 26 10:49:36 EDT 1999 | Wolfgang Busko
| | | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | | Going through datasheets wasn�t that helpfull, so does anyone know of a source
Electronics Forum | Fri Aug 25 08:13:51 EDT 2006 | saaitk
Hi Folks, When temp profiling bga rework how important is thermocouple placement. Have read that holes should be drilled from board underside into ball to accomodate probe (isn't theory wonderful). Probably ok for high volume rework but for 1 or 2 of
Electronics Forum | Thu Aug 26 10:21:22 EDT 1999 | John Thorup
| | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | Going through datasheets wasn�t that helpfull, so does anyone know of a source for
Electronics Forum | Fri Apr 15 08:23:14 EDT 2005 | cyber_wolf
We are seeing more and more jobs come in with matrix tray parts for our mydata machines. The problem is that the largest Y wagon will only hold 3 or less trays. We have some jobs that have 10+ trays. Currently our operators cut the trays down to sma
Electronics Forum | Wed Mar 12 06:12:09 EDT 2008 | omidjuve
we have pcb here that has a strange footprint on it the details for the device that should be placed on this pcb is part no. PSD833F2-90MI it has 3 different packages PQFP52,PLCC52,TQFP64 and the one that was in the BOM of this board was PQFP52. bu
