Electronics Forum | Wed Mar 03 06:13:23 EST 2010 | grahamcooper22
The picture shows that the heel of the device lead is not on the pad. Either bad placement or wrong pad dimensions. I imagine most customers would reject this joint as only a small part of the lead is actually in the solder. With no heel fillet the j
Electronics Forum | Mon Jun 21 13:16:18 EDT 2021 | tomdegas
I just received the following messages while running our MY15: I-OSM-0: my15n150 kernel: lp: no devices found. I also received this one: I-OSM-0: my15n150 insmod: /lib/modules/2.2.20/misc/lp.o: init_module: Device or resource busy. And this one: I-
Electronics Forum | Tue Jun 07 11:48:51 EDT 2005 | Rob
Simple Greg, we are users of machines & you are a manufacturer of machines. How many times have you personally found that your Fuji is too small to handle your boards recently? The customer has a Panasonic CM202, which from memory goes from 50x50mm
Electronics Forum | Wed Nov 04 10:28:04 EST 2009 | vetteboy86
Its been a while since I've worked with a QSP-2 > but I seem to remember that they should have a > puff off value where the machine will actually > blow the part off of the nozzle. I think it was > adjustable under the component handling but I >
Electronics Forum | Thu Jun 21 20:46:53 EDT 2001 | davef
I doubt it. [Although, I can't say that I understand this as well as I'd like.] Francois Monette has a good handle on the topic. He has demonstated superior knowledge in this area with postings on the following threads on SMTnet: * Date: January
Electronics Forum | Wed Sep 01 14:23:04 EDT 1999 | Dave F
| Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! | | TX | Mark | Mark: Jennie Hwang, a sometimes SMTnet visitor,
Electronics Forum | Thu Mar 23 12:40:37 EST 2006 | patrickbruneel
Russ, On a serious note it's impossible to optical see the bottom. The only way to verify is cross sectioning. Tin can't handle stress very well unless lead is added to make the alloy more elastic. We come back on the subject when the "field" starts
Electronics Forum | Sun Jun 18 13:07:12 EDT 2006 | mika
Please specify your needs. If you want to use a Fuji CP6 ship-shooter for chip placement on a pcb that are already glued before in an earlier process; the answer is yes. But the CP-6 itself can't handle the glue process, since it is a pure placeme
Electronics Forum | Mon Nov 27 10:37:16 EST 2006 | slthomas
"I have talked with their tech support at CircuitCam and they also indicate that the software does NOT support splitting large programs." I haven't used it but that's surprising. How does it handle a chip shooter next to a flexible placer? Is it jus
Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson
This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l
