Electronics Forum: cant handle device (Page 9 of 43)

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 17:30:40 EDT 2007 | jmelson

Oh, for a second there I thought it was 257 C, not F. Solder temperature! Still, one WEEK at 257 F seems way extreme. Maybe this is to bake out a part that has been underwater for a week. Is this a military part? I can't imagine any commercial-g

Samsung CP45FV Neo Programming

Electronics Forum | Mon Mar 03 07:15:24 EST 2014 | JB

Thanks for the reply, how do people handle different packages then if you can't add new ones? If we had a 1206 sized inductor, then a 1206 sized ferrite bead and so on, they would all have to be grouped under the same generic heading? e.g. Chip-R321

advice on used P&P

Electronics Forum | Mon Jun 22 04:39:11 EDT 2020 | jmelson

> Don't get yourself a Sapphire!! Right, that has a whole bunch of nozzles, and I can't imagine how they can have cameras on all of them. Couldn't handle larger parts, the nozzles are too close together. Jon

How to fix flex bent after reflow

Electronics Forum | Wed Nov 02 02:04:43 EDT 2022 | angela t

Bend it for mounting,if it can't be mounted by bending assembly. you can choose other pick and place machine which can handle this flex pcb. How long is this flex board? And do you use jigs when reflow? Could you please send a picture of the jig yo

ERSA scope?

Electronics Forum | Fri Aug 17 17:49:25 EDT 2001 | slthomas

Saw one at Apex last year, pretty cool device. Not cheap, though, as you've stated. Zarrow thinks everyone that's doing BGA should have one. O.C. White makes an instrument that does something quite similar, although I think it uses more mirrors and

Re: Selective Soldering

Electronics Forum | Wed Jan 13 00:38:06 EST 1999 | Chris G.

| I need leads on equipment vendors for selective soldering systems. I have information about ERSA and Seho already. I want to contact Air Vac in particular, but I can't find thier phone number. Thanks for the help | Another for your list. Gener

PBGA Replacement

Electronics Forum | Mon Sep 22 16:00:43 EDT 2003 | Joe

Two BGA replacements (same location) and throw the card away is the rule we are following. Experience has taught us that anything beyond this and you'd be pushing it - specifically when your new PBGA's price is above $20.00. The biggest concern is

Comet Philips machine error

Electronics Forum | Wed Nov 16 09:33:39 EST 2005 | SuMoTe

I can't help you with most of that, but heres a starting point. "L013: 2nd limit over" means that one of your axis is showing outside operating boundries, as in placement head is too far forward. Make sure all your devices are not pushed out to thie

Voiding in LGA (LT) soldering

Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan

We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als

Questions on underfill process

Electronics Forum | Fri Jun 08 15:37:41 EDT 2007 | ck_the_flip

Jim: I have limited knowledge, but here's what I know: 1. Yes, it's a standard process. In today's SMTNet, it's rarely mentioned, and few people reply to postings. 2. Nope. It's a "specialty" piece of equipment for most CEM's. Depending on you


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