Electronics Forum: cap plating (Page 1 of 9)

Chip capasitor plating

Electronics Forum | Tue Jan 10 12:17:17 EST 2006 | Rob

Hi, The ROHS compliant parts are usually Matte Tin on the outer terminal plating. There are also 2 further types of metal on the average chip cap - the undercoat metal of the outer electrode & the inner electrode. These are usually the same & are

Sn/Pb paste with SAC plating

Electronics Forum | Thu Oct 21 16:31:23 EDT 2004 | Tony

I have a component manufacturer that is using Sn/Ag/Cu plating on chip caps and resistors. Does anyone have any information on compatability with Sn/Pb paste. Are any changes in profile required? Is the reliability of the solder joint at risk? Tony

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob

Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger

Leadfree component plating on Sn/Pb paste

Electronics Forum | Sat Jun 21 00:37:20 EDT 2003 | nifhail

Most of the capacitors & resistors supplier have implemented Leadfree finished on their components and like it or not, most of the PCBA house already using them in their process. I just got a notice from my component supplier telling me that they wil

Tombstone defect

Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef

Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.

Bright Tin metalisation on CHIP components

Electronics Forum | Tue Jan 19 10:27:33 EST 2021 | grahamcooper22

Anyone experience high voiding levels in SMT lead free solder joints when the CHIP has bright tin plated end caps ? In the same process, Matte tin plated CHIPs don't show any voiding issues.

Leaching

Electronics Forum | Tue Apr 29 09:43:30 EDT 2003 | davef

With a nickel barrier and 'tin' plating, reconsider your reflow recipe to reduce the leaching of the termination into the solder during reflow. Points are: * In designing a reflow temperature recipe, it is important that the temperature be raised at

RNETs and Lead Free

Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum

We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi

Solder beads on small caps and res.

Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS

Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?

Voids in solder fillet

Electronics Forum | Thu Apr 17 14:14:17 EDT 2003 | davef

Takfire Questions are: * Why does your customer think the capacitor is the issue? [What are we thinking? Of course the capacitor is causing this voiding problem. What else could it be?] * What are the type, construction, end-cap material and plati

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