Electronics Forum | Tue Jan 29 17:11:32 EST 2019 | slthomas
Your product is Class 3, correct? Otherwise, a clearly wetted connection is all you need.
Electronics Forum | Wed Jan 30 03:01:39 EST 2019 | robl
You could use a stepped stencil around the parts you're having issues with to add a greater paste deposit to them and not the rest, or slightly elongate the apertures and overprint, but this may lead to solder balling.
Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas
In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Fri Jun 23 07:15:41 EDT 2017 | emeto
My pallet is 13mm high(because of electrolytics)and I have a issues with TH parts. Removing them will reduce my pallet height significantly and will fix my current issues.
Electronics Forum | Wed Jul 12 16:21:26 EDT 2017 | bk
When i considered using one I bought a cheaper brand named aoyue which cost less then $140 U.S. just to see if it would work for what we were trying. It did work but our engineering dept wound up scrapping it and doing a redesign. I was going to get
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Sat Aug 19 21:06:09 EDT 2006 | mika
Hi all, At our Fuji CP-6 machines we place a lot of 0402:s, 0603:s and 0805:s chip capacitors. Our problem is that the height of the components can sometime be very extreme from different vendors. I am sure you all have experience of this phenomenon
Electronics Forum | Mon Aug 21 10:36:25 EDT 2006 | vikkaraja
I Think I understand your problem. But I think it would be best if you just go in the program and change/check your componet height as needed. It does not take much time. Check your cap height, modify shape data as needed, generate your program and
