Electronics Forum | Mon Jun 07 20:06:45 EDT 1999 | Frank
Thanks for the clarification! So in generic settings what are the normally the components with the smallest pitch? Will a machine with 20 mil capability handle almost anything? | | I was wondering what measurements are used to define pitch? | | |
Electronics Forum | Mon Nov 06 11:00:58 EST 2006 | SteveH
What low profile components are you dealing with? We have had problems with cleaning under leadless chip carriers using an aquastorm 200 with Kyzen Aquanox 4520T and the general concensus is that you will not clean under this type of device with an
Electronics Forum | Thu Apr 26 16:55:31 EDT 2007 | ratsalad
I am guessing Theresa is saying when that some SMT parts are soldered (not glued) very close to some PTH parts. So close that they can't effectively mask the SMT parts and have an opening for the PTH part. At the company where I work, we've been tr
Electronics Forum | Mon Jun 18 11:54:35 EDT 2007 | grantp
Hi, The problem seemed to be across multiple batches of boards, so I think they were made correctly, and we don't use a carrier in the reflow oven. However we just moved our equipment to the new factory yesterday, and connect and start turning on
Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef
We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe
Electronics Forum | Wed Jan 30 15:10:09 EST 2013 | hegemon
Restoration of the fluxing properties? Can't see adding a liquid flux to a solder paste (assumed expired shelf life) in order to "restore" anything. If the volatiles in the original paste are gone, then adding more carriers and volatiles will not pr
Electronics Forum | Mon Jun 10 10:23:47 EDT 2019 | don_julio
We started getting better reflow after rotating the pcb to locate the greater mass closer to the center of the oven. However we still leave space between panels on the conveyor to achieve a better reflow. This costs us production time. I'm simply lo
Electronics Forum | Fri Mar 10 12:12:55 EST 2000 | Russ
Casey, I will start with the lack of thermo-couple control - The unit I have is based on time and temp. exclusively. What happens when a cold board gets reworked vs. a hot board? No bottom side preheat, the heating is very localized to topside a
Electronics Forum | Fri Mar 10 12:12:55 EST 2000 | Russ
Casey, I will start with the lack of thermo-couple control - The unit I have is based on time and temp. exclusively. What happens when a cold board gets reworked vs. a hot board? No bottom side preheat, the heating is very localized to topside a
Electronics Forum | Thu Sep 14 19:19:38 EDT 2006 | SWAG
I would try to panelize as big as you can for sure as you'll spend more time handling single boards than running anything. Additionally, this size is very close to smallest capabilities on GSM depending on your configuration. Fids on all boards in
